l l l l Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s l Hole-less TO-247 for clip mount High current capability High frequency IGBT and.

Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 600 2.5 TJ = 25°C TJ.

HiPerFAST IGBT

IXGX50N60AU1S

IXGX50N60A2D1

IXGX50N60B2D1

IXGX50N60C2D1

IXGX50N90B2D1

IXGX55N120A3H1

IXGX120N120A3

IXGX120N120B3

IXGX120N60A3

IXGX120N60B

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