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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
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Hole-less TO-247 for clip mount High current capability High frequency IGBT and.
Symbol Test Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 600 2.5 TJ = 25°C TJ.
HiPerFAST IGBT
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